Conti Said to Ready Another Bond Issue - Tire Review (Lower Heyford) Conti Said to Ready Another Bond Issue - Tire Review (Lower Heyford)

Thursday, 2 September 2010

Conti Said to Ready Another Bond Issue - Tire Review (Lower Heyford)

Conti Said to Ready Another Bond Issue - Tire Review

Conti Said to Ready Another Bond Issue
Tire Review
Bloomberg reported that Continental “is seeking to extend maturities on more than 8 billion euros of bank loans it used to fund its acquisition of Siemens ...
Continental Said to Issue Up to $1.3 Billion of BondsBusinessWeek
Continental Raises $1.3 Billion From First European Junk Bond in a MonthBloomberg

all 16 news articles »

Source: news.google.com

Huawei Receives Equipment Clearances in India - PC World

IBTimes Hong Kong

Huawei Receives Equipment Clearances in India
PC World
Nokia Siemens said last month that orders for its equipment from service providers have started getting cleared by the DOT under earlier less stringent ...
Huawei Reported to Have Won Indian 3G Network ContractCellular-News
Huawei's Indian ambitions stalled (for now) but rival ZTE flies high in EuropeTelecomTV
Huawei bags Tata Tele's 3G gear dealHindu Business Line

all 14 news articles »

Source: news.google.com

Zacks Analyst Blog Highlights: Joy Global, Motorola, Nokia, Siemens AG and Apple - Zacks.com

Zacks Analyst Blog Highlights: Joy Global, Motorola, Nokia, Siemens AG and Apple
Zacks.com
Recently, Motorola agreed to sell its telecom unit to Nokia Siemens Networks, a 50-50 joint venture between Nokia Corp. (NOK - Analyst Report) and Siemens ...

and more »

Source: news.google.com

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